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CII11722: Notice of bond interest payment of CII122020

Jun 4th at 15:42
04-06-2019 15:42:58+07:00

CII11722: Notice of bond interest payment of CII122020

Ho Chi Minh City Infrastructure Investment Joint Stock Company announces the record date for bond interest payment as follows:

-       Bond name: CII122020 Bond

-       Bond code: CII11722

-       Purpose: to pay for the bond interest (from December 29, 2018 to June 29, 2019)

-       Record date: June 14, 2019

-       Payment date: July 01, 2019 (because June 29 and 30, 2019 are not business days)

-       Place of payment:

  • Bondholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.
  • Bondholders whose bonds have not been deposited: at Ho Chi Minh City Securities Corporation (20th Floor, Sun Wah Building, 115 Nguyen Hue, Ben Nghe ward, district 1, HCMC).

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